Adhesive bonding using variable frequency microwave energy

Patent · Thu Jan 01 00:00:00 EST 1998

OSTI ID:871798

Lauf, Robert J ^[1]; McMillan, April D ^[2]; Paulauskas, Felix L ^[1]; Fathi, Zakaryae ^[3]; Wei, Jianghua ^[4]

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1. Oak Ridge, TN
2. Knoxville, TN
3. Cary, NC
4. Raleigh, NC

Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy.

• Research Organization: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
• DOE Contract Number: AC05-84OR21400
• Assignee: Lambda Technologies Inc. (Raleigh, NC); Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
• Patent Number(s): US 5798395
• OSTI ID: 871798
• Country of Publication: United States
• Language: English

Related Subjects

adhesive
bonding
variable
frequency
microwave
energy
methods
facilitating
various
components
disclosed
time
required
cure
polymeric
decreased
placing
bonded
via
heating
apparatus
multimode
cavity
irradiated
microwaves
varying
frequencies
uniformly
articles
conductive
fibers
disposed
therein
provided
selectively
oriented
enter
edge
portion
article
shielded
adhesive bonding
time required
conductive fibers
frequency microwave
variable frequency
microwave energy
disposed therein
microwave heating
various components
edge portion
wave energy
heating apparatus
polymeric adhesive
fibers therein
uniformly heat
adhesive bond
various component
/522/156/204/219/