Particle-free microchip processing
Patent
·
OSTI ID:870442
- 7723 Storrie Pl. NE., Albuquerque, NM 87109
- 7217 Ottawa Rd. NE., Albuquerque, NM 87109
Method and apparatus for reducing particulate contamination in microchip processing are disclosed. The method and apparatus comprise means to reduce particle velocity toward the wafer before the particles can be deposited on the wafer surface. A reactor using electric fields to reduce particle velocity and prevent particulate contamination is disclosed. A reactor using a porous showerhead to reduce particle velocities and prevent particulate contamination is disclosed.
- Research Organization:
- AT&T
- DOE Contract Number:
- AC04-76DP00789
- Assignee:
- Geller, Anthony S. (7723 Storrie Pl. NE., Albuquerque, NM 87109);Rader, Daniel J. (7217 Ottawa Rd. NE., Albuquerque, NM 87109)
- Patent Number(s):
- US 5522933
- OSTI ID:
- 870442
- Country of Publication:
- United States
- Language:
- English
Flow Phenomena in Chemical Vapor Deposition of Thin Films
|
journal | January 1991 |
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method
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comprise
means
reduce
particle
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wafer
particles
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surface
reactor
electric
fields
prevent
porous
showerhead
velocities
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reduce particle
electric field
electric fields
particulate contamination
wafer surface
apparatus comprise
particle velocity
microchip processing
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microchip
processing
method
apparatus
reducing
particulate
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comprise
means
reduce
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wafer
particles
deposited
surface
reactor
electric
fields
prevent
porous
showerhead
velocities
processing method
reduce particle
electric field
electric fields
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wafer surface
apparatus comprise
particle velocity
microchip processing
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