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Title: Diorganosilacetylene-alt-diorganosilvinylene polymers and a process of preparation

Patent ·
OSTI ID:870109

The present invention provides linear organosilicon polymers including acetylene and vinylene moieties, and a process for their preparation. These diorganosilacetylene-alt-diorganosilvinylene linear polymers can be represented by the formula: --[--(R.sup.1)(R.sup.2)Si--C.tbd.C--(R.sup.3)(R.sup.4)Si--CH.dbd.CH--].sub .n --, wherein n.gtoreq.2; and each R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is independently selected from the group consisting of hydrogen, halogen, alkyl, alkenyl, aryl, and aralkyl radicals. The polymers are soluble in organic solvents, air stable, and can be pulled into fibers or cast into films. They can be thermally converted into silicon carbide ceramic materials.

Research Organization:
Ames Laboratory (AMES), Ames, IA; Iowa State Univ., Ames, IA (United States)
DOE Contract Number:
W-7405-ENG-82
Assignee:
Iowa State University Research Foundation, Inc. (Ames, IA)
Patent Number(s):
US 5457074
Application Number:
08/202,936
OSTI ID:
870109
Country of Publication:
United States
Language:
English

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Structural and Electronic Properties of Polymeric Amorphous Semiconductors Si1−xCx:H book January 1987
Synthesis and study of silylene-diacetylene polymers journal October 1990
Si-methyl(fluoro)-substituted derivatives of trans-1, 2-disilylethylene
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