Dry soldering with hot filament produced atomic hydrogen
- Edgewood, NM
- Albuquerque, NM
- Los Lunas, NM
A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.
- Research Organization:
- AT&T
- DOE Contract Number:
- AC04-76DP00789
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Number(s):
- US 5409543
- OSTI ID:
- 869845
- Country of Publication:
- United States
- Language:
- English
Similar Records
Effect of firing conditions on thick film microstructure and solder joint strength for low-temperature, co-fired ceramic substrates
Effect of Thick Film Firing Conditions on the Solderability and Structure of Au-Pt-Pd Conductor for Low-Temperature, Co-Fired Ceramic Substrates
Related Subjects
soldering
hot
filament
produced
atomic
hydrogen
chemically
transforming
metal
surface
oxides
especially
exclusively
suitable
preparing
surfaces
solder
reflow
processes
employs
refractory
filaments
grids
thermally
dissociate
molecular
species
pressure
gas
hydrogen-containing
produce
reactive
plasma
reduce
form
volatile
compounds
removed
flow
applicable
manufacture
printed
circuit
boards
semiconductor
chip
lead
attachment
packaging
multichip
modules
retrofitted
existing
treatment
ovens
furnaces
welding
systems
wave
designs
volatile compound
chemically reduce
semiconductor chip
hydrogen-containing gas
forming metal
atomic hydrogen
preparing metal
form volatile
molecular species
circuit board
metal surface
metal surfaces
refractory metal
gas flow
metal oxide
metal oxides
containing gas
printed circuit
hot filament
reactive species
circuit boards
reactive plasma
surface oxides
active species
metal filaments
molecular specie
flow process
dry soldering
chemically transforming
surface oxide
active plasma
/134/219/228/