Methods for patterned deposition on a substrate

Patent · Sun Jan 01 00:00:00 EST 1995

OSTI ID:869700

Rye, Robert R ^[1]; Ricco, Antonio J ^[1]; Hampden-Smith, M J ^[1]; Kodas, T T ^[1]

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1. Albuquerque, NM

A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto.

• Research Organization: AT&T
• DOE Contract Number: AC04-76DP00789
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 5380474
• OSTI ID: 869700
• Country of Publication: United States
• Language: English

Related Subjects

methods
patterned
deposition
substrate
method
described
depositions
material
surface
polymeric
etched
form
layer
enhanced
adhesions
characteristics
selected
portions
removed
define
pattern
diminished
adhesion
conductor
remaining
embodiment
ptfe
chemically
improve
copper
thereto
thereafter
irradiated
laser
beam
remove
patterns
polymeric substrate
laser beam
selected portion
selected portions
adhesion characteristics
etched surface
chemically etched
enhanced adhesion
patterned deposition
/264/216/427/