Dual manifold heat pipe evaporator

Patent · Sat Jan 01 00:00:00 EST 1994

OSTI ID:869109

Adkins, Douglas R ^[1]; Rawlinson, K Scott ^[1]

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1. Albuquerque, NM

An improved evaporator section for a dual manifold heat pipe. Both the upper and lower manifolds can have surfaces exposed to the heat source which evaporate the working fluid. The tubes in the tube bank between the manifolds have openings in their lower extensions into the lower manifold to provide for the transport of evaporated working fluid from the lower manifold into the tubes and from there on into the upper manifold and on to the condenser portion of the heat pipe. A wick structure lining the inner walls of the evaporator tubes extends into both the upper and lower manifolds. At least some of the tubes also have overflow tubes contained within them to carry condensed working fluid from the upper manifold to pass to the lower without spilling down the inside walls of the tubes.

• Research Organization: AT&T
• DOE Contract Number: AC04-76DP00789
• Assignee: Sandia National Laboratories (Albuquerque, NM)
• Patent Number(s): US 5275232
• OSTI ID: 869109
• Country of Publication: United States
• Language: English

Related Subjects

dual
manifold
heat
pipe
evaporator
improved
section
upper
manifolds
surfaces
exposed
source
evaporate
fluid
tubes
tube
bank
openings
extensions
provide
transport
evaporated
condenser
portion
wick
structure
lining
inner
walls
extends
overflow
contained
carry
condensed
pass
spilling
inside
tube bank
flow tube
tubes extend
inner wall
heat pipe
heat source
inside wall
wick structure
inner walls
surfaces exposed
tubes contain
dual manifold
manifold heat
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