Microchannel cooling of face down bonded chips

Patent · Fri Jan 01 00:00:00 EST 1993

OSTI ID:868813

Bernhardt, Anthony F ^[1]

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1. Berkeley, CA

Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• DOE Contract Number: W-7405-ENG-48
• Assignee: United States of America as represented by United States (Washington, DC)
• Patent Number(s): US 5218515
• OSTI ID: 868813
• Country of Publication: United States
• Language: English

Related Subjects

microchannel
cooling
bonded
chips
applied
flip-chip
integrated
circuits
manner
maintains
advantages
bonds
overcoming
difficulties
encountered
technique
suited
multichip
circuit
boards
plane
stacks
dimensional
interconnect
structure
mounted
board
control
collapse
essentially
permanently
coupled
chip
coolant
delivery
manifold
delivers
seal
consisting
compressible
elastomer
provided
connected
form
replaceable
module
easily
decoupled
supply
manifolds
disposed
stack
supplies
circuit board
integrated circuits
integrated circuit
circuit boards
circuit chip
channel structure
interconnect structure
supply manifold
circuit chips
microchannel cooling
chip bond
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