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Title: Method for the thermal characterization, visualization, and integrity evaluation of conducting material samples or complex structures

Patent ·
OSTI ID:868551

A method for modeling a conducting material sample or structure (herein called a system) as at least two regions which comprise an electrical network of resistances, for measuring electric resistance between at least two selected pairs of external leads attached to the surface of the system, wherein at least one external lead is attached to the surface of each of the regions, and, using basic circuit theory, for translating measured resistances into temperatures or thermophysical properties in corresponding regions of the system.

Research Organization:
EG & G IDAHO INC
DOE Contract Number:
AC07-76ID01570
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Number(s):
US 5165794
OSTI ID:
868551
Country of Publication:
United States
Language:
English