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Title: Soft x-ray reduction camera for submicron lithography

Patent ·
OSTI ID:867756
 [1];  [2]
  1. 2708 Rembrandt Pl., Modesto, CA 95356
  2. 7911 Mines Rd., Livermore, CA 94550

Soft x-ray projection lithography can be performed using x-ray optical components and spherical imaging lenses (mirrors), which form an x-ray reduction camera. The x-ray reduction is capable of projecting a 5x demagnified image of a mask onto a resist coated wafer using 4.5 nm radiation. The diffraction limited resolution of this design is about 135 nm with a depth of field of about 2.8 microns and a field of view of 0.2 cm.sup.2. X-ray reflecting masks (patterned x-ray multilayer mirrors) which are fabricated on thick substrates and can be made relatively distortion free are used, with a laser produced plasma for the source. Higher resolution and/or larger areas are possible by varying the optic figures of the components and source characteristics.

Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
DOE Contract Number:
W-7405-ENG-48
Assignee:
Hawryluk, Andrew M. (2708 Rembrandt Pl., Modesto, CA 95356);Seppala, Lynn G. (7911 Mines Rd., Livermore, CA 94550)
Patent Number(s):
US 5003567
OSTI ID:
867756
Country of Publication:
United States
Language:
English