Method and device for stand-off laser drilling and cutting

Patent · Tue Sep 26 00:00:00 EDT 1989

OSTI ID:867116

Copley, John A ^[1]; Kwok, Hoi S ^[2]; Domankevitz, Yacov ^[2]

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1. Rte. 11, Box 1022, Fredericksburg, VA 22405
2. 214 Bonner Hall, SUNY-Buffalo, Buffalo, NY 14260

A device for perforating material and a method of stand-off drilling using a laser. In its basic form a free-running laser beam creates a melt on the target and then a Q-switched short duration pulse is used to remove the material through the creation of a laser detonation wave. The advantage is a drilling/cutting method capable of working a target at lengthy stand-off distance. The device may employ 2 lasers or a single one operated in a free-running/Q-switched dual mode.

• Assignee: Copley, John A. (Rte. 11, Box 1022, Fredericksburg, VA 22405);Kwok, Hoi S. (214 Bonner Hall, SUNY-Buffalo, Buffalo, NY 14260);Domankevitz, Yacov (214 Bonner Hall, SUNY-Buffalo, Buffalo, NY 14260)
• Patent Number(s): US 4870244
• Application Number: 07/254,629
• OSTI ID: 867116
• Country of Publication: United States
• Language: English

Related Subjects

method
device
stand-off
laser
drilling
cutting
perforating
material
basic
form
free-running
beam
creates
melt
target
q-switched
duration
pulse
remove
creation
detonation
wave
advantage
capable
lengthy
distance
employ
lasers
single
operated
dual
mode
detonation wave
method capable
laser beam
laser drilling
basic form
cutting method
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