Method for manufacturing electrical contacts for a thin-film semiconductor device

Patent · Tue Nov 08 00:00:00 EST 1988

OSTI ID:866769

Carlson, David E ^[1]; Dickson, Charles R ^[2]; D'Aiello, Robert V ^[3]

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1. Yardley, PA
2. Pennington, NJ
3. East Brunswick, NJ

A method of fabricating spaced-apart back contacts on a thin film of semiconductor material by forming strips of buffer material on top of the semiconductor material in locations corresponding to the desired dividing lines between back contacts, forming a film of metal substantially covering the semiconductor material and buffer strips, and scribing portions of the metal film overlying the buffer strips with a laser without contacting the underlying semiconductor material to separate the metal layer into a plurality of back contacts. The buffer material serves to protect the underlying semiconductor material from being damaged during the laser scribing. Back contacts and multi-cell photovoltaic modules incorporating such back contacts also are disclosed.

• DOE Contract Number: ZB4030563
• Assignee: Solarex Corporation (Rockville, MD)
• Patent Number(s): US 4783421
• Application Number: 07/068,753
• OSTI ID: 866769
• Country of Publication: United States
• Language: English

Related Subjects

method
manufacturing
electrical
contacts
thin-film
semiconductor
device
fabricating
spaced-apart
film
material
forming
strips
buffer
top
locations
corresponding
desired
dividing
lines
metal
substantially
covering
scribing
portions
overlying
laser
contacting
underlying
separate
layer
plurality
serves
protect
damaged
multi-cell
photovoltaic
modules
incorporating
disclosed
underlying semiconductor
buffer material
metal film
photovoltaic modules
electrical contacts
photovoltaic module
metal layer
electrical contact
semiconductor material
semiconductor device
substantially cover
laser scribing
substantially covering
thin-film semiconductor
film semiconductor
cell photovoltaic
material serves
forming strips
fabricating spaced-apart
locations corresponding
/438/136/257/