Electrically conductive resinous bond and method of manufacture
- 865 N. Village Dr., Apt. 101B, St. Petersburg, FL 33702
A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40.degree. to 365.degree. C. to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.
- Research Organization:
- General Electric Co., Boston, MA (United States)
- DOE Contract Number:
- AC04-76DP00656
- Assignee:
- Snowden, Jr.; Thomas M. (P.O. Box 4231, Clearwater, FL 33518); Wells; Barbara J. (865 N. Village Dr., Apt. 101B, St. Petersburg, FL 33702)
- Patent Number(s):
- US 4666547
- OSTI ID:
- 866253
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
conductive
resinous
bond
method
manufacture
bonding
elements
strength
electrical
conductivity
comprises
applying
unfilled
polyimide
resin
surfaces
bonded
heat
treating
stages
temperature
range
40
degree
365
form
strong
adhesive
metal-filled
overcoat
provide
connection
therebetween
substantially
profile
concerned
resilient
void
free
combination
providing
attachment
major
amount
minor
provide electrical
major amount
temperature profile
temperature range
electrically conductive
electrical conductivity
electrical connection
minor amount
heat treating
polyimide resin
void free
substantially void
conductive elements
conductive adhesive
adhesive bond
provide electric
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