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Title: Electrically conductive resinous bond and method of manufacture

Patent ·
OSTI ID:866253
 [1]
  1. 865 N. Village Dr., Apt. 101B, St. Petersburg, FL 33702

A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40.degree. to 365.degree. C. to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.

Research Organization:
General Electric Co., Boston, MA (United States)
DOE Contract Number:
AC04-76DP00656
Assignee:
Snowden, Jr.; Thomas M. (P.O. Box 4231, Clearwater, FL 33518); Wells; Barbara J. (865 N. Village Dr., Apt. 101B, St. Petersburg, FL 33702)
Patent Number(s):
US 4666547
OSTI ID:
866253
Country of Publication:
United States
Language:
English