Diffusion bonding

Patent · Tue Jun 22 00:00:00 EDT 1976

OSTI ID:862575

Anderson, Robert C ^[1]

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1. Oak Ridge, TN

1. A method for joining beryllium to beryllium by diffusion bonding, comprising the steps of coating at least one surface portion of at least two beryllium pieces with nickel, positioning a coated surface portion in a contiguous relationship with an other surface portion, subjecting the contiguously disposed surface portions to an environment having an atmosphere at a pressure lower than ambient pressure, applying a force upon the beryllium pieces for causing the contiguous surface portions to abut against each other, heating the contiguous surface portions to a maximum temperature less than the melting temperature of the beryllium, substantially uniformly decreasing the applied force while increasing the temperature after attaining a temperature substantially above room temperature, and maintaining a portion of the applied force at a temperature corresponding to about maximum temperature for a duration sufficient to effect the diffusion bond between the contiguous surface portions.

• Research Organization: UNION CARBIDE CORP
• DOE Contract Number: W-7405-ENG-26
• Assignee: United States of America as represented by United States Energy (Washington, DC)
• Patent Number(s): US 3964667
• OSTI ID: 862575
• Country of Publication: United States
• Language: English

Related Subjects

diffusion
bonding
method
joining
beryllium
comprising
steps
coating
surface
portion
pieces
nickel
positioning
coated
contiguous
relationship
subjecting
contiguously
disposed
portions
environment
atmosphere
pressure
ambient
applying
force
causing
abut
heating
maximum
temperature
melting
substantially
uniformly
decreasing
applied
increasing
attaining
maintaining
corresponding
duration
sufficient
effect
bond
surface portions
temperature substantially
substantially uniformly
coated surface
surface portion
melting temperature
substantially uniform
maximum temperature
ambient pressure
fusion bonding
applied force
beryllium pieces
temperature corresponding
diffusion bonding
fusion bond
joining beryllium
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