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Title: Module Encapsulant Diagnostic and Modeling

Abstract

Encapsulant materials are used in photovoltaic devices for mechanical support, electrical isolation, and protection against corrosion. The ability of an encapsulant to protect against surface corrosion is related to its adhesional strength. The adhesion of candidate encapsulants under accelerated environmental stress was examined to determine what materials have the best hydrolytic stability and are more likely to reduce corrosion rates. Under environmental exposure, the ingress of water has been correlated with increased corrosion rates. The diffusivity of different encapsulants has been measured to determine how long it takes for water to enter a module. The high diffusivity of ethylene vinyl acetate indicates that, even with the use of an impermeable back-sheet, moisture from the sides will diffuse throughout the entire module. To significantly reduce moisture ingress requires a true hermetic seal, the use of an encapsulant loaded with desiccant, or the use of a very low diffusivity encapsulant.

Authors:
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
860684
Report Number(s):
NREL/CP-520-37027
TRN: US200524%%235
DOE Contract Number:  
AC36-99-GO10337
Resource Type:
Conference
Resource Relation:
Related Information: Presented at the 2004 DOE Solar Energy Technologies Program Review Meeting, 25-28 October 2004, Denver, Colorado. Also included in the proceedings available on CD-ROM (DOE/GO-102005-2067; NREL/CD-520-37140)
Country of Publication:
United States
Language:
English
Subject:
14 SOLAR ENERGY; 36 MATERIALS SCIENCE; ADHESION; CORROSION; ENVIRONMENTAL EXPOSURE; ETHYLENE; MOISTURE; POLYVINYLS; SIMULATION; STABILITY; WATER; SOLAR ENERGY; PV; ELECTRICAL ISOLATION; ENCAPSULANT MATERIALS; ETHYLENE VINYL ACETATE (EVA); IMPERMEABLE BACK-SHEET; MODULE; WATER VAPOR TRANSMISSION RATE (WVTR); HYDROLYTIC STABILITY; Solar Energy - Photovoltaics

Citation Formats

Kempe, M. Module Encapsulant Diagnostic and Modeling. United States: N. p., 2005. Web.
Kempe, M. Module Encapsulant Diagnostic and Modeling. United States.
Kempe, M. 2005. "Module Encapsulant Diagnostic and Modeling". United States. https://www.osti.gov/servlets/purl/860684.
@article{osti_860684,
title = {Module Encapsulant Diagnostic and Modeling},
author = {Kempe, M},
abstractNote = {Encapsulant materials are used in photovoltaic devices for mechanical support, electrical isolation, and protection against corrosion. The ability of an encapsulant to protect against surface corrosion is related to its adhesional strength. The adhesion of candidate encapsulants under accelerated environmental stress was examined to determine what materials have the best hydrolytic stability and are more likely to reduce corrosion rates. Under environmental exposure, the ingress of water has been correlated with increased corrosion rates. The diffusivity of different encapsulants has been measured to determine how long it takes for water to enter a module. The high diffusivity of ethylene vinyl acetate indicates that, even with the use of an impermeable back-sheet, moisture from the sides will diffuse throughout the entire module. To significantly reduce moisture ingress requires a true hermetic seal, the use of an encapsulant loaded with desiccant, or the use of a very low diffusivity encapsulant.},
doi = {},
url = {https://www.osti.gov/biblio/860684}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Jan 01 00:00:00 EST 2005},
month = {Sat Jan 01 00:00:00 EST 2005}
}

Conference:
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