Anomalous creep in Sn-rich solder joints
Journal Article
·
· Materials Transactions JIM (The Japan Institute of Metals).
OSTI ID:840870
This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Director. Office of Science. Office of Basic Energy Sciences. Division of Materials Sciences and Engineering; Intel Corporation (US)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 840870
- Report Number(s):
- LBNL-49931; R&D Project: 511201; TRN: US200513%%26
- Journal Information:
- Materials Transactions JIM (The Japan Institute of Metals)., Vol. 43, Issue 8; Other Information: Submitted to Materials Transactions JIM (The Japan Institute of Metals): Volume 43, No.8; Journal Publication Date: 08/2002; PBD: 15 Mar 2002
- Country of Publication:
- United States
- Language:
- English
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