Anomalous creep in Sn-rich solder joints

Journal Article · Fri Mar 15 00:00:00 EST 2002 · Materials Transactions JIM (The Japan Institute of Metals).

OSTI ID:840870

Song, Ho Geon; Morris, Jr, John W; Hua, Fay

This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.

• Research Organization: Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
• Sponsoring Organization: USDOE Director. Office of Science. Office of Basic Energy Sciences. Division of Materials Sciences and Engineering; Intel Corporation (US)
• DOE Contract Number: AC03-76SF00098
• OSTI ID: 840870
• Report Number(s): LBNL-49931; R&D Project: 511201; TRN: US200513%%26
• Journal Information: Materials Transactions JIM (The Japan Institute of Metals)., Vol. 43, Issue 8; Other Information: Submitted to Materials Transactions JIM (The Japan Institute of Metals): Volume 43, No.8; Journal Publication Date: 08/2002; PBD: 15 Mar 2002
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
CREEP
TIN BASE ALLOYS
METALLURGICAL FLUX
SOLDERED JOINTS
SILVER ALLOYS
COPPER ALLOYS
INDIUM ALLOYS
CREEP BEHAVIOR TIN-RICH SOLDER ALLOY LEAD-FREE SOLDER JOINTS