Study of bump bonding technology
Pixel detectors proposed for the new generation of hadron collider experiments will use bump-bonding technology based on either indium or Pb/Sn solder to connect the front-end readout chips to the silicon pixel sensors. We have previously reported large-scale tests of the yield using both indium and Pb/Sn solder bump [1]. The conclusion is that both seem to be viable for pixel detectors. We have also carried out studies of various effects (e.g. storage over long period, effect of heating and cooling, and radiation) on both types of bump bonds using daisy-chained parts on a small scale [2], [3]. Overall, these tests showed little changes in the integrity of the bump connections. Nevertheless, questions still remain on the long-term reliability of the bumps due to thermal cycle effects, attachment to a substrate with a different coefficient of thermal expansion (CTE), and radiation.
- Research Organization:
- Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- USDOE Office of Energy Research (ER) (US)
- DOE Contract Number:
- AC02-76CH03000
- OSTI ID:
- 816381
- Report Number(s):
- FERMILAB-Conf-03/311-E; TRN: US0305013
- Resource Relation:
- Conference: 9th Workshop on Electronics for LHC Experiments, Amsterdam (NL), 09/29/2003--10/03/2003; Other Information: PBD: 17 Oct 2003
- Country of Publication:
- United States
- Language:
- English
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A study of thermal cycling and radiation effects on indium and solder bump bonds
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