Residual stress measurement in YBCO thin films.
Residual stress in YBCO films on Ag and Hastelloy C substrates was determined by using 3-D optical interferometry and laser scanning to measure the change in curvature radius before and after film deposition. The residual stress was obtained by appropriate analysis of curvature measurements. Consistent with residual thermal stress calculations based on the thermal expansion coefficient mismatch between the substrates and YBCO film, the measured residual stress in the YBCO film on Hastelloy C substrate was tensile, while it was compressive on the Ag substrate. The stress values measured by the two techniques were generally in good agreement, suggesting that optical interferometry and laser scanning have promise for measuring residual stresses in thin films.
- Research Organization:
- Argonne National Lab., IL (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- W-31-109-ENG-38
- OSTI ID:
- 795038
- Report Number(s):
- ANL/ET/CP-107651; TRN: US200210%%91
- Resource Relation:
- Conference: 104th Annual Meeting and Exposition of the American Ceramic Society, St. Louis, MO (US), 04/28/2002--05/01/2002; Other Information: PBD: 13 May 2002
- Country of Publication:
- United States
- Language:
- English
Similar Records
Evolution of Stress in ScD{sub 2}/Cr Thin Films Fabricated by Evaporation and High Temperature Reaction
Effect of internal residual stress on the dielectric properties and microstructure of sputter-deposited polycrystalline (Ba,Sr)TiO{sub 3} thin films