Creep of SiC Hot-Pressed with Al, B, and C
- Univ. of California, Berkeley, CA (United States)
The creep of a high strength, high toughness SiC, sintered with Al, B, and C was investigated. For elevated temperature applications, the time-dependent deformation, creep response, must be fully characterized for candidate materials. The mechanisms responsible for high temperature deformation in ABC-SiC were evaluated. The creep response was compared to materials that have glassy grain boundary phases but do not have interlocked grains. The creep mechanisms were assessed.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 764381
- Report Number(s):
- LBNL-45436; R&D Project: 512601; TRN: AH200102%%137
- Resource Relation:
- Other Information: TH: Thesis (Ph.D.); Submitted to University of California, Berkeley, CA (US) and Lawrence Berkeley National Laboratory, CA (US); PBD: 31 Mar 2000
- Country of Publication:
- United States
- Language:
- English
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