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Title: Interfacing Detectors to Triggers And DAQ Electronics

Technical Report ·
DOI:https://doi.org/10.2172/762167· OSTI ID:762167

The complete design of the front-end electronics interfacing LHCb detectors, Level-0 trigger and higher levels of trigger with flexible configuration parameters has been made for (a) ASIC implementation, and (b) FPGA implementation. The importance of approaching designs in technology-independent form becomes essential with the actual rapid electronics evolution. Being able to constrain the entire design to a few types of replicated components: (a) the fully programmable 3D-Flow system, and (b) the configurable front-end circuit described in this article, provides even further advantages because only one or two types of components will need to migrate to the newer technologies. To base on today's technology the design of a system such as the LHCb project that is to begin working in 2006 is not cost-effective. The effort required to migrate to a higher-performance will, in that case, be almost equivalent to completely redesigning the architecture from scratch. The proposed technology independent design with the current configurable front-end module described in this article and the scalable 3D-Flow fully programmable system described elsewhere, based on the study of the evolution of electronics during the past few years and the forecasted advances in the years to come, aims to provide a technology-independent design which lends itself to any technology at any time. In this case, technology independence is based mainly on generic-HDL reusable code which allows a very rapid realization of the state-of-the-art circuits in terms of gate density, power dissipation, and clock frequency. The design of four trigger towers presently fits into an OR3T30 FPGA. Preliminary test results (provided in this paper) meet the functional requirements of LHCb and provide sufficient flexibility to introduce future changes. The complete system design is also provided along with the integration of the front-end design in the entire system and the cost and dimension of the electronics.

Research Organization:
3D-Computing, Inc., DeSoto. TX 75115 (US)
Sponsoring Organization:
USDOE; USDOE Office of Energy Research (ER) (US)
DOE Contract Number:
FG03-95ER81905
OSTI ID:
762167
Resource Relation:
Other Information: PBD: 3 May 1999
Country of Publication:
United States
Language:
English