Ultrasonic evaluation of beryllium-copper diffusion bonds
A study was performed to compare the effectiveness of several advanced ultrasonic techniques when used to determine the strength of diffusion bonded beryllium-copper, which heretofore have each been applied to only a few material systems. The use of integrated backscatter calculations, frequency domain reflection coefficients, and time-of-flight variance was compared in their ability to characterize the bond strength in a series of beryllium-copper diffusion bond samples having a wide variation in bond quality. Correlation of integrated backscatter calculations and time-of-flight variance with bond strength was good. Some correlation of the slope of the frequency based reflection coefficient was shown for medium and high strength bonds, while its Y-intercept showed moderate correlation for all bond strengths.
- Research Organization:
- Kansas City Plant, Kansas City, MO (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 756292
- Report Number(s):
- KCP-613-6332; TRN: AH200019%%121
- Resource Relation:
- Other Information: PBD: 8 Jun 2000
- Country of Publication:
- United States
- Language:
- English
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