Influence of Rapid Thermal Ramp Rate on Phase Transformation of Titanium Silicides
ULSI technology requires low resistance, stable silicides formed on small geometry lines. Titanium disilicide (TiSiz), which is the most widely used silicide for ULSI applications, exists in two crystallographic phases: the high resistance, metastable C49 phase and the low resistance, stable C54 phase. The major issue with TiSiz is the increasing thermal budget required to transform the C49 phase into the low resistance C54 phase as linewiths decrease below 0.25 pm. Annealing above 900"C to obtain this transformation often results in thermal degradation, so it is desirable to reduce the transformation temperature. The transformation temperature has been shown to be a fi.mction of many factors including microstructure, grain size, and impurities. In this paper we report an investig+ion of rapid thermal silicidation of titanium films (250, 400, and 600 A) on single crystalline silicon at temperatures from 300 to 1000"C. The ramp rates for these experiments are 5, 30, 70, and 200oC/s. The transformation temperature decreases as the ramp rate increases and as the initial film thickness increases. Scanning electron microscopy (SEM) is used to analyze the resultant film microstructure. The ramp rate influence on Ti silicidation is also investigated on polycrystalline Si lines with widths ranging from 0.27 to 3.0 pm.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 7149
- Report Number(s):
- SAND99-1007C; ON: DE00007149
- Resource Relation:
- Conference: 195th Meeting of the Electrochemical Society; Seattle, WA; 05/02-06/1999
- Country of Publication:
- United States
- Language:
- English
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