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Title: Severe shock and vibration environments for electronic components

Conference ·
OSTI ID:7030210

Electronic components used in system applications must be qualified to mechanical shock and vibration environments. Often these environments are severe, requiring the development and use of special test techniques and procedures. Environmental specifications are based upon analytical model predictions and measured test data. Test specifications are determined after careful consideration of simulation techniques, input levels, dynamic behavior of the test fixturing, as well as an assessment of the degree of conservatism imposed by the specification and testing procedures. The process of determining component shock and vibration specifications is discussed, beginning with the initial description of system and subsystem level environments, and concluding with component level test specifications. Included is a discussion of the difference between environmental specifications and test specifications, and the instrumentation/measurement problems associated with obtaining valid field measurements for severe shock data. The role of finite element analysis in predicting the dynamic structural response of components is also explained. Shock data analysis techniques are described including both time-domain and frequency-domain characterizations of the data. The resonant plate shock testing technique for simulating severe shock environments is presented, including difficulties that arise in practical applications. 18 refs., 10 figs.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
Sponsoring Organization:
DOE/DP
DOE Contract Number:
AC04-76DP00789
OSTI ID:
7030210
Report Number(s):
SAND-89-2730C; CONF-9006121-1; ON: DE90007686
Resource Relation:
Conference: 4. international SAMPE electronic materials and processes conference, Albuquerque, NM (USA), 12-14 Jun 1990
Country of Publication:
United States
Language:
English