Thermal Analysis of a SHIELD Electromigration Test Structure
The steady state and transient thermal behavior of an electromigration test structure was analyzed. The test structure was a Sandia SHIELD (Self-stressing HIgh fregquency rELiability Device) electromigration test device manufactured by an outside vendor. This device has a high frequency oscillator circuit, a buffer circuit to isolate and drive the metal line to the tested (DUT), the DUT to be electromigrated itself, a metal resistance thermometry monitor, and a heater elment to temperature accelerate the electromigration effect.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 7021
- Report Number(s):
- SAND99-1171; ON: DE00007021
- Country of Publication:
- United States
- Language:
- English
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