Fracture toughness (K{sub IC}) data reduction program
This report documents the development, verification, and use instructions for an automated K{sub IC} data reduction program written in the Hewlett Packard Visual Engineering Environment (HP VEE) programming language. Currently, when the standard test method Plane-Strain Fracture Toughness of Metallic materials (K{sub IC}), is performed, the data is reduced manually. Date reduction includes 15 detailed calculations required by the American Society for Testing and Materials (ASTM) E399 to determine the validity of the computed K{sub IC} value. Manual data reduction is both time consuming, tedious, and prone to errors. Since all K{sub IC} tests are completed using a data acquisition system to digitally record time, load, and crack opening displacement (COD); automation of K{sub IC} data reduction using a computer program to perform all calculations rapidly, enables processing of a large amount of data. The K{sub IC} data reduction program reduces any computer American Standard Code for Information Interchange (ASCII) data file. Thus, the K{sub IC} data reduction program is also used to over check tests performed at other facilities. The program was qualified based on mechanical properties of commercial alloy specimens.
- Research Organization:
- Bettis Atomic Power Lab., West Mifflin, PA (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC11-93PN38195
- OSTI ID:
- 663569
- Report Number(s):
- WAPD-T-3194; ON: DE98006083; TRN: AHC29818%%407
- Resource Relation:
- Other Information: PBD: [1998]
- Country of Publication:
- United States
- Language:
- English
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