Low-temperature curing of a nitrile-epoxy adhesive. Final report
Adhesive strength and glass transition temperature were correlated with cure times at 85/sup 0/C and above. The effect of moisture on adhesive cure and strength was tested. With a 3-hour cure at 85/sup 0/C, lap shear strength met specification requirements. The adhesive was found to absorb moisture with time, especially if one or both polyethylene covers are removed. Placing the adhesive in a desiccator for 30 minutes produced excellent room temperature shear strengths. Preconditioning (removal of moisture) is critical for elevated temperature cures.
- Research Organization:
- Bendix Corp., Kansas City, MO (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6574057
- Report Number(s):
- BDX-613-2553
- Country of Publication:
- United States
- Language:
- English
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