Design and characterization of microscale heater structures for test die and sensor applications
- Sandia National Labs., Albuquerque, NM (United States)
- Philips Semiconductors, Albuquerque, NM (United States)
The authors describe a class of microscale heaters fabricated with CMOS processes on silicon wafers. These heaters were designed to produce localized high temperatures above 400 C for test and sensor applications. The temperature levels produced for various input powers and the thermal profiles surrounding the heater for packaged and wafer-level heater structures were studied to guide the placement of microelectronics integrated with the heater structures on the same die. To show the performance of the design, they present resistance sensor measurements, IR temperature profiles, and results from a 3D thermal model of the die. This effort demonstrates that it is possible to successfully operate both a microscale heater and microcircuits on the same die.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE Office of Financial Management and Controller, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 645474
- Report Number(s):
- SAND-97-2893C; CONF-980512-; ON: DE98001387; BR: YN0100000; TRN: AHC2DT03%%15
- Resource Relation:
- Conference: ITHERM `98, Seattle, WA (United States), 27-30 May 1998; Other Information: PBD: May 1998
- Country of Publication:
- United States
- Language:
- English
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