Ground boundaries

Technical Report · Mon Jan 01 00:00:00 EST 1990

DOI:https://doi.org/10.2172/6341492· OSTI ID:6341492

Balluffi, R W; Bristowe, P D

The present document is a progress report describing the work accomplished on the study of grain boundaries in Ag, Au, Ni, Si, and Ge. Research was focused on the following four major efforts: study of the atomic structure of grain boundaries by means of x-ray diffraction, transmission electron microscopy and computer modeling; grain boundary migration; short-circuit diffusion along grain boundaries; and development of Thin-Film Deposition/Bonding Apparatus for the manufacture of high purity bicrystals. 10 refs., 1 fig.

• Research Organization: Massachusetts Inst. of Tech., Cambridge, MA (USA). Dept. of Materials Science and Engineering
• Sponsoring Organization: DOE/ER
• DOE Contract Number: FG02-87ER45310
• OSTI ID: 6341492
• Report Number(s): DOE/ER/45310-21; ON: DE91004027
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
GERMANIUM
MICROSTRUCTURE
GOLD ALLOYS
NICKEL ALLOYS
SILICON
SILVER ALLOYS
CHEMICAL BONDS
DEPOSITION
DIFFUSION
DISLOCATIONS
GRAIN BOUNDARIES
PROGRESS REPORT
SEGREGATION
SEMICONDUCTOR MATERIALS
THIN FILMS
X-RAY DIFFRACTION
ALLOYS
COHERENT SCATTERING
CRYSTAL DEFECTS
CRYSTAL STRUCTURE
DIFFRACTION
DOCUMENT TYPES
ELEMENTS
FILMS
LINE DEFECTS
MATERIALS
METALS
SCATTERING
SEMIMETALS
360102* - Metals & Alloys- Structure & Phase Studies