Low-thermal-resistance, high-electrical-isolation heat intercept connection
- Argonne National Lab., IL (United States)
- Fermi National Accelerator Lab., Batavia, IL (United States)
A method for providing a low-thermal-resistance, high-electrical-isolation heat intercept connection is presented. Electrical conductors often require the removal of heat produced from their normal operation. The heat can be removed by mechanical connection to a refrigeration source. Such connections require both effective heat removal (low thermal resistance) and effective electrical isolation (high electrical resistance and high dielectric strength). Such connections should be straightforward to fabricate and provide reliable performance that is independent of operating temperature. The connection method described here involves clamping, by thermal interference fit, an electrically insulating cylinder between an outer metallic ring and an inner metallic disk.
- Research Organization:
- Argonne National Lab., IL (United States)
- Sponsoring Organization:
- USDOE; USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-31109-ENG-38
- OSTI ID:
- 6303595
- Report Number(s):
- ANL/ET/CP-77896; CONF-930703-5; ON: DE93017398
- Resource Relation:
- Conference: International cryogenic engineering conference and international cryogenic materials conference, Albuquerque, NM (United States), 12-16 Jul 1993
- Country of Publication:
- United States
- Language:
- English
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Low-thermal-resistance, high-electrical-isolation heat intercept connection
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Related Subjects
HEAT
REMOVAL
JOINTS
DIELECTRIC PROPERTIES
ELECTRICAL INSULATION
THERMAL CONDUCTION
DIELECTRIC MATERIALS
ELECTRIC CONDUCTIVITY
HEAT TRANSFER
REFRIGERATION
THERMAL INSULATION
COOLING
ELECTRICAL PROPERTIES
ENERGY
ENERGY TRANSFER
MATERIALS
PHYSICAL PROPERTIES
420200* - Engineering- Facilities
Equipment
& Techniques