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Title: Structural and interfacial characteristics of thin (<10 nm) SiO sub 2 films grown by electron cyclotron resonance plasma oxidation on (100) Si substrates

Conference ·
OSTI ID:6170854

The feasibility of fabricating ultra-thin SiO{sub 2} films on the order of a few nanometer thickness has been demonstrated. SiO{sub 2} thin films of approximately 7 nm thickness have been produced by ion flux-controlled Electron Cyclotron Resonance plasma oxidation at low temperature on (100) Si substrates, in reproducible fashion. Electrical measurements of these films indicate that they have characteristics comparable to those of thermally grown oxides. The thickness of the films was determined by ellipsometry, and further confirmed by cross-sectional High-Resolution Transmission Electron Microscopy. Comparison between the ECR and the thermal oxide films shows that the ECR films are uniform and continuous over at least a few microns in lateral direction, similar to the thermal oxide films grown at comparable thickness. In addition, HRTEM images reveal a thin (1--1.5 nm) crystalline interfacial layer between the ECR film and the (100) substrate. Thinner oxide films of approximately 5 nm thickness have also been attempted, but so far have resulted in nonuniform coverage. Reproducibility at this thickness is difficult to achieve.

Research Organization:
Lawrence Berkeley Lab., CA (United States)
Sponsoring Organization:
USDOE; USDOD; National Science Foundation (NSF); USDOE, Washington, DC (United States); Department of Defense, Washington, DC (United States); National Science Foundation, Washington, DC (United States)
DOE Contract Number:
AC03-76SF00098; FG03-87ER13727
OSTI ID:
6170854
Report Number(s):
LBL-29964; CONF-910406-38; ON: DE92004425; CNN: F49620-87-K-0001; ECS-8517363; ENG-8710988
Resource Relation:
Conference: Spring meeting of the Materials Research Society (MRS), Anaheim, CA (United States), 29 Apr - 3 May 1991
Country of Publication:
United States
Language:
English