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Title: LPCVD tungsten deposition on Si-Ge alloy

Conference ·
OSTI ID:6088250

The Radioisotope Thermoelectric Generator (RTG) consists of a heat source, an 80/20 Si-Ge thermopile, MIN-K insulation, and a stainless steel container. The dc diode sputtered tungsten bridges interconnect alternate wafers in the thermopile. The diffusion of silicon into the tungsten interconnects appears to be the cause of a sudden increase in contact resistance after a period of time. The low pressure chemical vapor deposition (LPCVD) technique is compared with sputtering for this reason. LPCVD is found to be simpler than sputtering, self-cleaning, and not prone to damage the surface as does sputtering. Aging profiles are found to tend toward the high end of the acceptance window. (LEW)

Research Organization:
Science Applications, Inc., Rockville, MD (USA); Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6088250
Report Number(s):
SAND-84-2267C; CONF-8411141-1; ON: DE85005588
Resource Relation:
Conference: Workshop on tungsten for VLSI applications, Albuquerque, NM, USA, 12 Nov 1984
Country of Publication:
United States
Language:
English