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Title: The variability residual stresses of thick superconductor films during orthorhombic to tetragonal transformation

Conference ·
OSTI ID:5633801
;  [1]; ;  [2]
  1. Illinois Univ., Chicago, IL (United States). Dept. of Civil Engineering, Mechanics, and Metallurgy
  2. Argonne National Lab., IL (United States)

YBa{sub 2}Cu{sub 3}O{sub x} thick films have been deposited by spray pyrolysis of a sol-gel on 10 cm diameter polycrystalline MgO wafers. The film thickness was built up in layers of approximately 1 {mu}m thick. The in-plane residual stresses were measured by an optical interferometry (shadow moire) method as a function of film structure. In-plane residual stress maps over the area of the wafer have been obtained. The average stress of the 5 {mu}m orthorhombic phase was 0.84 GPa. As the film transforms from the orthorhombic to the tetragonal structure, the tensile stresses decreased by 0.5 GPa.

Research Organization:
Argonne National Lab., IL (United States)
Sponsoring Organization:
USDOE; USDOE, Washington, DC (United States)
DOE Contract Number:
W-31109-ENG-38
OSTI ID:
5633801
Report Number(s):
ANL/CP-75687; CONF-9203110-2; ON: DE92010499
Resource Relation:
Conference: 8. international conference on advanced science and technology, Argonne, IL (United States), 28 Mar 1992
Country of Publication:
United States
Language:
English