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Title: Pad polishing for rapid production of large flats

Abstract

Pad polishing is an efficient technique for polishing-out a ground surface and reaching a figure better than one wave, ready for completion with less than an hour on a planetary polisher. For the 350 mm square piece of BK-7, removal was one micrometer every 10 minutes. Polishing-out from a 5 micrometer grind took less than 3 hours, to a surface smoothness of one nm rms. Other tests verified that the pad leaves no unusual subsurface damage. Following completion on a pitch planetary polisher, surface finish is the same as obtained for conventional processing. Unlike pitch, the pad retains its surface figure, producing a uniform result when used on a production basis. Coupled with the speed of production and low capital cost of overarm machines, it provides a cost-effective approach.

Authors:
;
Publication Date:
Research Org.:
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
544685
Report Number(s):
LA-UR-97-3036; CONF-970706-
ON: DE98000970; TRN: 97:005799
DOE Contract Number:  
W-7405-ENG-36
Resource Type:
Conference
Resource Relation:
Conference: Annual meeting of the Society of Photo-Optical Instrumentation Engineers, San Diego, CA (United States), 27 Jul - 1 Aug 1997; Other Information: PBD: 1997
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; 66 PHYSICS; OPTICAL EQUIPMENT; MECHANICAL POLISHING; FABRICATION; SURFACES

Citation Formats

Berggren, R R, and Schmell, R A. Pad polishing for rapid production of large flats. United States: N. p., 1997. Web.
Berggren, R R, & Schmell, R A. Pad polishing for rapid production of large flats. United States.
Berggren, R R, and Schmell, R A. 1997. "Pad polishing for rapid production of large flats". United States. https://www.osti.gov/servlets/purl/544685.
@article{osti_544685,
title = {Pad polishing for rapid production of large flats},
author = {Berggren, R R and Schmell, R A},
abstractNote = {Pad polishing is an efficient technique for polishing-out a ground surface and reaching a figure better than one wave, ready for completion with less than an hour on a planetary polisher. For the 350 mm square piece of BK-7, removal was one micrometer every 10 minutes. Polishing-out from a 5 micrometer grind took less than 3 hours, to a surface smoothness of one nm rms. Other tests verified that the pad leaves no unusual subsurface damage. Following completion on a pitch planetary polisher, surface finish is the same as obtained for conventional processing. Unlike pitch, the pad retains its surface figure, producing a uniform result when used on a production basis. Coupled with the speed of production and low capital cost of overarm machines, it provides a cost-effective approach.},
doi = {},
url = {https://www.osti.gov/biblio/544685}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Nov 01 00:00:00 EST 1997},
month = {Sat Nov 01 00:00:00 EST 1997}
}

Conference:
Other availability
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