Pad polishing for rapid production of large flats
Abstract
Pad polishing is an efficient technique for polishing-out a ground surface and reaching a figure better than one wave, ready for completion with less than an hour on a planetary polisher. For the 350 mm square piece of BK-7, removal was one micrometer every 10 minutes. Polishing-out from a 5 micrometer grind took less than 3 hours, to a surface smoothness of one nm rms. Other tests verified that the pad leaves no unusual subsurface damage. Following completion on a pitch planetary polisher, surface finish is the same as obtained for conventional processing. Unlike pitch, the pad retains its surface figure, producing a uniform result when used on a production basis. Coupled with the speed of production and low capital cost of overarm machines, it provides a cost-effective approach.
- Authors:
- Publication Date:
- Research Org.:
- Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
- Sponsoring Org.:
- USDOE, Washington, DC (United States)
- OSTI Identifier:
- 544685
- Report Number(s):
- LA-UR-97-3036; CONF-970706-
ON: DE98000970; TRN: 97:005799
- DOE Contract Number:
- W-7405-ENG-36
- Resource Type:
- Conference
- Resource Relation:
- Conference: Annual meeting of the Society of Photo-Optical Instrumentation Engineers, San Diego, CA (United States), 27 Jul - 1 Aug 1997; Other Information: PBD: 1997
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; 66 PHYSICS; OPTICAL EQUIPMENT; MECHANICAL POLISHING; FABRICATION; SURFACES
Citation Formats
Berggren, R R, and Schmell, R A. Pad polishing for rapid production of large flats. United States: N. p., 1997.
Web.
Berggren, R R, & Schmell, R A. Pad polishing for rapid production of large flats. United States.
Berggren, R R, and Schmell, R A. 1997.
"Pad polishing for rapid production of large flats". United States. https://www.osti.gov/servlets/purl/544685.
@article{osti_544685,
title = {Pad polishing for rapid production of large flats},
author = {Berggren, R R and Schmell, R A},
abstractNote = {Pad polishing is an efficient technique for polishing-out a ground surface and reaching a figure better than one wave, ready for completion with less than an hour on a planetary polisher. For the 350 mm square piece of BK-7, removal was one micrometer every 10 minutes. Polishing-out from a 5 micrometer grind took less than 3 hours, to a surface smoothness of one nm rms. Other tests verified that the pad leaves no unusual subsurface damage. Following completion on a pitch planetary polisher, surface finish is the same as obtained for conventional processing. Unlike pitch, the pad retains its surface figure, producing a uniform result when used on a production basis. Coupled with the speed of production and low capital cost of overarm machines, it provides a cost-effective approach.},
doi = {},
url = {https://www.osti.gov/biblio/544685},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Nov 01 00:00:00 EST 1997},
month = {Sat Nov 01 00:00:00 EST 1997}
}