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Title: Evaluation of the metal/adhesive interfaces in the MC2370 fire set

Abstract

Several analysis methods have been applied to evaluate the structure and composition of the electrode/adhesive interfaces i previously fielded M2370 Fire Sets. A method of interfacial fracture at cryogenic temperatures as been employed to expose regions of these interfaces at multiple levels in a SFE stack. Electron microscopy shows that bond failure induced by the fracture is predominantly adhesive with an equal probability of failure of the Au and Cu interfaces. Some evidence for cohesive, indicative of a possible microstructure related to electrical breakdown. Pinhole-free larger regions of adhesive also exist which may explain the observed high resistance in impedance measurements.

Authors:
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
538064
Report Number(s):
SAND-97-2460C; CONF-970982-
ON: DE98000382; TRN: 97:005489
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: 21. aging, compatibility, and stockpile stewardship conference, Albuquerque, NM (United States), 30 Sep - 2 Oct 1997; Other Information: PBD: 1997
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; SILICONES; MICROSTRUCTURE; COPPER; GOLD; INTERFACES; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; ADHESIVES; ELECTRODES; CRACKS

Citation Formats

Zavadil, K R. Evaluation of the metal/adhesive interfaces in the MC2370 fire set. United States: N. p., 1997. Web.
Zavadil, K R. Evaluation of the metal/adhesive interfaces in the MC2370 fire set. United States.
Zavadil, K R. 1997. "Evaluation of the metal/adhesive interfaces in the MC2370 fire set". United States. https://www.osti.gov/servlets/purl/538064.
@article{osti_538064,
title = {Evaluation of the metal/adhesive interfaces in the MC2370 fire set},
author = {Zavadil, K R},
abstractNote = {Several analysis methods have been applied to evaluate the structure and composition of the electrode/adhesive interfaces i previously fielded M2370 Fire Sets. A method of interfacial fracture at cryogenic temperatures as been employed to expose regions of these interfaces at multiple levels in a SFE stack. Electron microscopy shows that bond failure induced by the fracture is predominantly adhesive with an equal probability of failure of the Au and Cu interfaces. Some evidence for cohesive, indicative of a possible microstructure related to electrical breakdown. Pinhole-free larger regions of adhesive also exist which may explain the observed high resistance in impedance measurements.},
doi = {},
url = {https://www.osti.gov/biblio/538064}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Oct 01 00:00:00 EDT 1997},
month = {Wed Oct 01 00:00:00 EDT 1997}
}

Conference:
Other availability
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