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Title: Smart packaging for photonics

Abstract

Unlike silicon microelectronics, photonics packaging has proven to be low yield and expensive. One approach to make photonics packaging practical for low cost applications is the use of {open_quotes}smart{close_quotes} packages. {open_quotes}Smart{close_quotes} in this context means the ability of the package to actuate a mechanical change based on either a measurement taken by the package itself or by an input signal based on an external measurement. One avenue of smart photonics packaging, the use of polysilicon micromechanical devices integrated with photonic waveguides, was investigated in this research (LDRD 3505.340). The integration of optical components with polysilicon surface micromechanical actuation mechanisms shows significant promise for signal switching, fiber alignment, and optical sensing applications. The optical and stress properties of the oxides and nitrides considered for optical waveguides and how they are integrated with micromechanical devices were investigated.

Authors:
; ; ; ;  [1]
  1. ed.
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
534537
Report Number(s):
SAND-97-2337
ON: DE98000425; TRN: 97:005439
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: Sep 1997
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; WAVEGUIDES; OPTICAL PROPERTIES; ACTUATORS; SILICON; SEMICONDUCTOR MATERIALS; MACHINE PARTS; OPTICAL SYSTEMS

Citation Formats

Smith, J H, Carson, R F, Sullivan, C T, McClellan, G, and Palmer, D W. Smart packaging for photonics. United States: N. p., 1997. Web. doi:10.2172/534537.
Smith, J H, Carson, R F, Sullivan, C T, McClellan, G, & Palmer, D W. Smart packaging for photonics. United States. https://doi.org/10.2172/534537
Smith, J H, Carson, R F, Sullivan, C T, McClellan, G, and Palmer, D W. 1997. "Smart packaging for photonics". United States. https://doi.org/10.2172/534537. https://www.osti.gov/servlets/purl/534537.
@article{osti_534537,
title = {Smart packaging for photonics},
author = {Smith, J H and Carson, R F and Sullivan, C T and McClellan, G and Palmer, D W},
abstractNote = {Unlike silicon microelectronics, photonics packaging has proven to be low yield and expensive. One approach to make photonics packaging practical for low cost applications is the use of {open_quotes}smart{close_quotes} packages. {open_quotes}Smart{close_quotes} in this context means the ability of the package to actuate a mechanical change based on either a measurement taken by the package itself or by an input signal based on an external measurement. One avenue of smart photonics packaging, the use of polysilicon micromechanical devices integrated with photonic waveguides, was investigated in this research (LDRD 3505.340). The integration of optical components with polysilicon surface micromechanical actuation mechanisms shows significant promise for signal switching, fiber alignment, and optical sensing applications. The optical and stress properties of the oxides and nitrides considered for optical waveguides and how they are integrated with micromechanical devices were investigated.},
doi = {10.2172/534537},
url = {https://www.osti.gov/biblio/534537}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Sep 01 00:00:00 EDT 1997},
month = {Mon Sep 01 00:00:00 EDT 1997}
}