Aqueous dryfilm photoresist for thin film network pattern gold electroplating
Abstract
An aqueous dryfilm photoresist was evaluated and selected to replace a solvent based resist for pattern gold electroplating of thin film networks. The aqueous resist not only eliminated solvents from the process but also improved resolution, line width control, and underplating of the resist. The new resist has been used to make TFNs with narrow lines and spaces that could not be made with the old resist. The adhesion of the new resist has produced excellent results on sapphire substrates allowing a low yield TFN, made with an etchback process on evaporated gold, to be coverted to pattern electroplated gold. In contrast with prior positive dryfilm results where snap back'' caused voids around vias, via resistance has been excellent. 1 ref., 1 fig., 3 tabs.
- Authors:
- Publication Date:
- Research Org.:
- Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
- Sponsoring Org.:
- USDOE; USDOE, Washington, DC (United States)
- OSTI Identifier:
- 5287194
- Report Number(s):
- KCP-613-4673; CONF-9109259-7
ON: DE92000463
- DOE Contract Number:
- AC04-76DP00613
- Resource Type:
- Conference
- Resource Relation:
- Conference: 1. international congress on environmentally conscious manufacturing, Santa Fe, NM (United States), 18 Sep 1991
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 36 MATERIALS SCIENCE; 54 ENVIRONMENTAL SCIENCES; GOLD; ELECTROPLATING; PHOTORESISTORS; SOLVENTS; POLLUTION ABATEMENT; ADHESION; ALUMINIUM OXIDES; COMPRESSION STRENGTH; MICROELECTRONIC CIRCUITS; SODIUM HYDROXIDES; SUBSTRATES; THIN FILMS; ALKALI METAL COMPOUNDS; ALUMINIUM COMPOUNDS; CHALCOGENIDES; DEPOSITION; ELECTRICAL EQUIPMENT; ELECTRODEPOSITION; ELECTROLYSIS; ELECTRONIC CIRCUITS; ELEMENTS; EQUIPMENT; FILMS; HYDROGEN COMPOUNDS; HYDROXIDES; LYSIS; MECHANICAL PROPERTIES; METALS; OXIDES; OXYGEN COMPOUNDS; PLATING; RESISTORS; SODIUM COMPOUNDS; SURFACE COATING; TRANSITION ELEMENTS; 426000* - Engineering- Components, Electron Devices & Circuits- (1990-); 360101 - Metals & Alloys- Preparation & Fabrication; 540220 - Environment, Terrestrial- Chemicals Monitoring & Transport- (1990-)
Citation Formats
Hines, R A. Aqueous dryfilm photoresist for thin film network pattern gold electroplating. United States: N. p., 1991.
Web.
Hines, R A. Aqueous dryfilm photoresist for thin film network pattern gold electroplating. United States.
Hines, R A. 1991.
"Aqueous dryfilm photoresist for thin film network pattern gold electroplating". United States. https://www.osti.gov/servlets/purl/5287194.
@article{osti_5287194,
title = {Aqueous dryfilm photoresist for thin film network pattern gold electroplating},
author = {Hines, R A},
abstractNote = {An aqueous dryfilm photoresist was evaluated and selected to replace a solvent based resist for pattern gold electroplating of thin film networks. The aqueous resist not only eliminated solvents from the process but also improved resolution, line width control, and underplating of the resist. The new resist has been used to make TFNs with narrow lines and spaces that could not be made with the old resist. The adhesion of the new resist has produced excellent results on sapphire substrates allowing a low yield TFN, made with an etchback process on evaporated gold, to be coverted to pattern electroplated gold. In contrast with prior positive dryfilm results where snap back'' caused voids around vias, via resistance has been excellent. 1 ref., 1 fig., 3 tabs.},
doi = {},
url = {https://www.osti.gov/biblio/5287194},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun Sep 01 00:00:00 EDT 1991},
month = {Sun Sep 01 00:00:00 EDT 1991}
}