Development of a hybrid microcircuit test vehicle for surface mount applications
The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental concerns. Surface mount technology (SMT) has evolved in response to these issues. Prototype hybrid test vehicles have been developed at Sandia National Laboratories to evaluate three lead-free solders for Au-Pt-Pd thick film soldering. The alloys are based on the Sn-Ag, Sn-Ag-Bi and Sn-Ag-Bi-Au systems. Populated test vehicles with surface mount devices were designed and fabricated to evaluate actual solder joints. Pastes were screen printed on the test substrates and reflowed with the components in place. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCC`s). The development of the reflow profiles will be discussed. Comprehensive defect analysis will also be presented.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 527902
- Report Number(s):
- SAND-97-0553C; CONF-971028-1; ON: DE97007794; TRN: 97:005155
- Resource Relation:
- Conference: 30. international symposium on microelectronics, Philadelphia, PA (United States), 12-16 Oct 1997; Other Information: PBD: 1997
- Country of Publication:
- United States
- Language:
- English
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