Uniform aluminum deposits on large nonplanar and planar polyimide substrates by physical vapor deposition
The capability to deposit 10- to 12-..mu..m-thick aluminum films with less than 2 percent thickness uniformity (defined as standard deviation/average thickness) on large nonplanar and planar polyimide substrates has been developed using physical vapor deposition (PVD). A technique called shadow masking was developed to provide this consistent deposit uniformity over the entire substrate surfaces (greater than 2000 cm/sup 2/). The specific dimensions of a shadow mask for each substrate are generated from a computer-reduced plot of beta-backscatter thickness measurements of a previous deposit. With this developed method, initial thickness uniformities of 9.7 and 24.7 percent obtained for the nonplanar and planar deposits were improved to 1.07 and 1.80 percent, respectively.
- Research Organization:
- Bendix Corp., Kansas City, MO (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5185473
- Report Number(s):
- BDX-613-2397
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
ALUMINIUM
SURFACE COATING
THICKNESS
FILMS
IMIDES
ORGANIC POLYMERS
VAPOR DEPOSITED COATINGS
COATINGS
DEPOSITION
DIMENSIONS
ELEMENTS
METALS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
POLYMERS
360101* - Metals & Alloys- Preparation & Fabrication
360104 - Metals & Alloys- Physical Properties