Environmental evaluation of Surface Mounted Devices (SMD)
We evaluated the comparative reliability of solder interconnections used for Leadless Chip Carriers (LCCs), Meaded, and flat-pack hybrid microcircuits mounted on FR-4 glass epoxy printed wiring boards (PWBs). The board assemblies, with solder attached microcircuits, were repeatedly thermal cycled from - 65 to +125{degrees}C. We recognize that this temperature range far exceeds most testing of assemblies. The purposes of these tests were to evaluate worst-case conditions and to obtain comparative information. Identical PWB assemblies, using these three component types, were subjected to both thermal shock testing (1 cycle every 42 minutes) and temperature cycle testing (1 cycle every 3 hours). The double testing evaluated the differences in stress application and evaluated the potential of replacing slow transition, expensive temperature cycle testing (which has been an industry standard for years) with the much more rapid thermal shock testing.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE Office of Energy Research, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 486031
- Report Number(s):
- SAND-97-8499C; CONF-970355-2; ON: DE97052745; TRN: 97:004001
- Resource Relation:
- Conference: Circuits expo `97, San Jose, CA (United States), 9-13 Mar 1997; Other Information: PBD: 1997
- Country of Publication:
- United States
- Language:
- English
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