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Title: Coupled thermal/structural analyses of laser powered glass sealing methods for fiber optic and flat panel display applications

Conference ·
OSTI ID:481560

Glasses are used extensively by the electronics industry for packaging and in components. Because glasses have such low fracture toughness, glass components must maintain low tensile stresses to avoid cracking and ensure product stability. Modeling is a key tool for developing designs with low tensile stresses. Thermoelastic analyses are ideal for modeling slow, oven controlled processes where the temperature varies uniformly. Many processing environments, however, involve rapid heating and cooling cycles that produce nonhomogeneous temperature fields causing the volume and stresses in the glass to relax at different rates. This structural relaxation is an important nonlinear material behavior that gives rise to a point-to-point variability in effective properties of the material. To accurately model such stresses, a thermal analysis must be coupled to a structural analysis that employs a viscoelastic model of glass. Laser sealing of glasses is an example of a process where thermal history is an important factor in determining the residual stress state. Recent needs to consider laser sealing methods for fiber optic connectors and flat panel displays have spurred the development of coupled, three-dimensional thermal and structural finite element codes. Analyses of the temperatures and stresses generated in a flat panel display during a laser sealing operation are presented, an the idiosyncrasies and importance of modeling coupled thermal/structural phenomena are discussed.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
481560
Report Number(s):
SAND-96-2876C; CONF-970616-6; ON: DE97001210; TRN: AHC29712%%103
Resource Relation:
Conference: ASME international intersociety electronic and photonic packaging conference and exhibition, Honolulu, HI (United States), 15-19 Jun 1997; Other Information: PBD: [1996]
Country of Publication:
United States
Language:
English