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Title: Computer simulation of solder joint failure

Abstract

The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools for simulating the behavior of solder joints under strain and temperature cycling, taking into account the microstructural heterogeneities that exist in as-solidified near eutectic Sn-Pb joints, as well as subsequent microstructural evolution. The authors present two computational constitutive models, a two-phase model and a single-phase model, that were developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions. Unique metallurgical tests provide the fundamental input for the constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations with this model agree qualitatively with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single-phase model was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. Special thermomechanical fatigue tests were developed to give fundamental materials input to the models, and an in situ SEM thermomechanical fatiguemore » test system was developed to characterize microstructural evolution and the mechanical behavior of solder joints during the test. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests. The simulation results from the two-phase model showed good fit to the experimental test results.« less

Authors:
;  [1];  [2]
  1. Sandia National Lab., Albuquerque, NM (United States)
  2. Univ. of California, Davis, CA (United States)
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
477670
Report Number(s):
SAND-95-0086
ON: DE97006045; TRN: 97:003485
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: Apr 1997
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; SOLDERED JOINTS; FAILURES; FAILURE MODE ANALYSIS; ELECTRONIC EQUIPMENT; LEAD ALLOYS; TIN ALLOYS; EUTECTICS; ELECTRONIC CIRCUITS; FATIGUE; COMPUTERIZED SIMULATION

Citation Formats

Burchett, S N, Frear, D R, and Rashid, M M. Computer simulation of solder joint failure. United States: N. p., 1997. Web. doi:10.2172/477670.
Burchett, S N, Frear, D R, & Rashid, M M. Computer simulation of solder joint failure. United States. https://doi.org/10.2172/477670
Burchett, S N, Frear, D R, and Rashid, M M. 1997. "Computer simulation of solder joint failure". United States. https://doi.org/10.2172/477670. https://www.osti.gov/servlets/purl/477670.
@article{osti_477670,
title = {Computer simulation of solder joint failure},
author = {Burchett, S N and Frear, D R and Rashid, M M},
abstractNote = {The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools for simulating the behavior of solder joints under strain and temperature cycling, taking into account the microstructural heterogeneities that exist in as-solidified near eutectic Sn-Pb joints, as well as subsequent microstructural evolution. The authors present two computational constitutive models, a two-phase model and a single-phase model, that were developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions. Unique metallurgical tests provide the fundamental input for the constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations with this model agree qualitatively with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single-phase model was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. Special thermomechanical fatigue tests were developed to give fundamental materials input to the models, and an in situ SEM thermomechanical fatigue test system was developed to characterize microstructural evolution and the mechanical behavior of solder joints during the test. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests. The simulation results from the two-phase model showed good fit to the experimental test results.},
doi = {10.2172/477670},
url = {https://www.osti.gov/biblio/477670}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 01 00:00:00 EST 1997},
month = {Tue Apr 01 00:00:00 EST 1997}
}