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Title: Metal plasma immersion ion implantation and deposition: A review

Conference ·
OSTI ID:414413
 [1]
  1. Lawrence Berkeley National Lab., CA (United States). Accelerator and Fusion Research Div.

Metal Plasma Immersion Ion Implantation and Deposition (MePIIID) is a hybrid process combining cathodic arc deposition and plasma immersion ion implantation. The properties of metal plasma produced by vacuum arcs are reviewed and the consequences for MePIIID are discussed. Different version of MePIIID are described and compared with traditional methods of surface modification such as ion beam assisted deposition (IBAD). MePIIID is a very versatile approach because of the wide range of ion species and energies used. In one extreme case, films are deposited with ions in the energy range 20--50 eV, and at the other extreme, ions can be implanted with high energy (100 keV or more) without film deposition. Novel features of the technique include the use of improved macroparticle filters; the implementation of several plasma sources for multi-element surface modification; tuning of ion energy during implantation and deposition to tailor the substrate-film intermixed layer and structure of the growing film; simultaneous pulsing of the plasma potential (positive) and substrate bias (negative) with a modified Marx generator; and the use of high ion charge states.

Research Organization:
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
Sponsoring Organization:
USDOE Office of Energy Research, Washington, DC (United States)
DOE Contract Number:
AC03-76SF00098
OSTI ID:
414413
Report Number(s):
LBNL-38910; CONF-9609269-2; ON: DE97001256; TRN: AHC29701%%112
Resource Relation:
Conference: 3. international workshop on plasma-based ion implantation, Dresden (Germany), 15-18 Sep 1996; Other Information: PBD: Sep 1996
Country of Publication:
United States
Language:
English

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