Laser ablative cutting of ceramics for electronics applications
Pulsed, high-beam quality lasers offer unique materials processing characteristics. In processing metals, copper vapor and pulsed Nd:YAG lasers have produced micron-scale cuts and holes with submicron heat-affected zones. Since the cost of laser photons is high and average material removal rates can be slow with ablation, high value-added applications are necessary to justify processing costs. Ceramics present a special challenge for manufacturing because of their high hardness, relatively low thermal conductivity, and brittle nature. Surface damage typically limits the strength of a ceramic part to a small fraction of its bulk strength. This work investigates the use of copper vapor and pulsed diode-pumped Nd:YAG lasers to cut precision features in ceramic substrates. Variations in laser wavelength and power, processing speed, ceramic type, and assist gas were investigated with the goal of producing <100-{mu}m wide by 600-{mu}m deep cuts through silicon-carbide and alumina/titanium-carbide substrates for potential use in electronics. Silicon-carbide bars 250-{mu}m wide by 600-{mu}m high by 2.5-cm long were laser cut from substrates without fracture.
- Research Organization:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 324973
- Report Number(s):
- UCRL-ID-123677; ON: DE98054505; BR: HG0000000
- Resource Relation:
- Other Information: PBD: Mar 1996
- Country of Publication:
- United States
- Language:
- English
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