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Title: Failure analysis for micro-electrical-mechanical systems (MEMS)

Abstract

Micro-Electrical Mechanical Systems (MEMS) is an emerging technology with demonstrated potential for a wide range of applications including sensors and actuators for medical, industrial, consumer, military, automotive and instrumentation products. Failure analysis (FA) of MEMS is critically needed for the successful design, fabrication, performance analysis and reliability assurance of this new technology. Many devices have been examined using techniques developed for integrated circuit analysis, including optical inspection, scanning laser microscopy (SLM), scanning electron microscopy (SEM), focused ion beam (FIB) techniques, atomic force microscopy (AFM), infrared (IR) microscopy, light emission (LE) microscopy, acoustic microscopy and acoustic emission analysis. For example, the FIB was used to microsection microengines that developed poor performance characteristics. Subsequent SEM analysis clearly demonstrated the absence of wear on gear, hub, and pin joint bearing surfaces, contrary to expectations. Another example involved the use of infrared microscopy for thermal analysis of operating microengines. Hot spots were located, which did not involve the gear or hub, but indicated contact between comb structures which drive microengines. Voltage contrast imaging proved useful on static and operating MEMS in both the SEM and the FIB and identified electrostatic clamping as a potentially significant contributor to failure mechanisms in microengines. This work describesmore » MEMS devices, FA techniques, failure modes, and examples of FA of MEMS.« less

Authors:
; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE Assistant Secretary for Management and Administration, Washington, DC (United States)
OSTI Identifier:
292809
Report Number(s):
SAND-97-1733C; CONF-971037-
ON: DE97007265; TRN: AHC2DT08%%3
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: International symposium for testing and failure analysis, Santa Clara, CA (United States), 27-31 Oct 1997; Other Information: PBD: Oct 1997
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; FAILURE MODE ANALYSIS; INTEGRATED CIRCUITS; MINIATURIZATION; DIAGNOSTIC TECHNIQUES; MICROSCOPY; HYBRID SYSTEMS

Citation Formats

Peterson, K A, Tangyunyong, P, and Barton, D L. Failure analysis for micro-electrical-mechanical systems (MEMS). United States: N. p., 1997. Web.
Peterson, K A, Tangyunyong, P, & Barton, D L. Failure analysis for micro-electrical-mechanical systems (MEMS). United States.
Peterson, K A, Tangyunyong, P, and Barton, D L. 1997. "Failure analysis for micro-electrical-mechanical systems (MEMS)". United States. https://www.osti.gov/servlets/purl/292809.
@article{osti_292809,
title = {Failure analysis for micro-electrical-mechanical systems (MEMS)},
author = {Peterson, K A and Tangyunyong, P and Barton, D L},
abstractNote = {Micro-Electrical Mechanical Systems (MEMS) is an emerging technology with demonstrated potential for a wide range of applications including sensors and actuators for medical, industrial, consumer, military, automotive and instrumentation products. Failure analysis (FA) of MEMS is critically needed for the successful design, fabrication, performance analysis and reliability assurance of this new technology. Many devices have been examined using techniques developed for integrated circuit analysis, including optical inspection, scanning laser microscopy (SLM), scanning electron microscopy (SEM), focused ion beam (FIB) techniques, atomic force microscopy (AFM), infrared (IR) microscopy, light emission (LE) microscopy, acoustic microscopy and acoustic emission analysis. For example, the FIB was used to microsection microengines that developed poor performance characteristics. Subsequent SEM analysis clearly demonstrated the absence of wear on gear, hub, and pin joint bearing surfaces, contrary to expectations. Another example involved the use of infrared microscopy for thermal analysis of operating microengines. Hot spots were located, which did not involve the gear or hub, but indicated contact between comb structures which drive microengines. Voltage contrast imaging proved useful on static and operating MEMS in both the SEM and the FIB and identified electrostatic clamping as a potentially significant contributor to failure mechanisms in microengines. This work describes MEMS devices, FA techniques, failure modes, and examples of FA of MEMS.},
doi = {},
url = {https://www.osti.gov/biblio/292809}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Oct 01 00:00:00 EDT 1997},
month = {Wed Oct 01 00:00:00 EDT 1997}
}

Conference:
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