Simulation of Grain Growth in a Near-Eutectic Solder Alloy
Microstructural evolution due to aging of solder alloys determines their long-term reliability as electrical, mechanical and thermal interconnects in electronics packages. The ability to accurately determine the reliability of existing electronic components as well as to predict the performance of proposed designs depends upon the development of reliable material models. A kinetic Monte Carlo simulation was used to simulate microstructural evolution in solder-class materials. The grain growth model simulated many of the microstructural features observed experimentally in 63Sn-37Pb, a popular near-eutectic solder alloy. The model was validated by comparing simulation results to new experimental data on coarsening of Sn-Pb solder. The computational and experimental grain growth exponent for two-phase solder was found to be much lower than that for normal, single phase grain growth. The grain size distributions of solders obtained from simulations were narrower than that of normal grain growth. It was found that the phase composition of solder is important in determining grain growth behavior.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 15186
- Report Number(s):
- SAND99-3179J; TRN: US200221%%268
- Journal Information:
- Acta Mat., Other Information: Submitted to Acta Mat.; PBD: 16 Dec 1999
- Country of Publication:
- United States
- Language:
- English
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