skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Processing and characterization of high porosity aerogel films

Conference ·
OSTI ID:146801

Aerogels are highly porous solids having unique morphology among materials because both the pores and particles making up the material have sizes less than wavelengths of visible light. Such a unique morphology modifies the normal molecular transport mechanisms within the material, resulting in exceptional thermal, acoustical, mechanical, and electrical properties. For example, aerogels have the lowest measured thermal conductivity and dielectric constant for any solid material. Special methods are required to make aerogel films with high porosity. In this paper, we discuss the special conditions needed to fabricate aerogel films having porosities greater than 75% and we describe methods of processing inorganic aerogel films having controllable thicknesses in the range 0.5 to 200 micrometers. We report methods and results of characterizing the films including thickness, refractive index, density (porosity), and dielectric constant. We also discuss results of metallization and patterning on the aerogel films for applications involving microminiature electronics and thermal detectors.

Research Organization:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
W-7405-ENG-48
OSTI ID:
146801
Report Number(s):
UCRL-JC-117554; CONF-941144-176; ON: DE96002666
Resource Relation:
Conference: Fall meeting of the Materials Research Society (MRS), Boston, MA (United States), 28 Nov - 9 Dec 1994; Other Information: PBD: 22 Nov 1994
Country of Publication:
United States
Language:
English

Similar Records

Thin aerogel films for optical, thermal, acoustic, and electronic applications
Technical Report · Thu Sep 01 00:00:00 EDT 1994 · OSTI ID:146801

Silica aerogel: An intrinsically low dielectric constant material
Conference · Sat Apr 01 00:00:00 EST 1995 · OSTI ID:146801

Aerogels for electronics
Conference · Sat Oct 01 00:00:00 EDT 1994 · OSTI ID:146801