Characterization of the Effect of Au/Al Bondpad Corrosion on Microelectronic Device Reliability
A methodology has been established to predict the effect of atmospheric corrosion on the reliability of plastic encapsulated microelectronic (PEM) devices. New experimental techniques were developed to directly characterize the Al/Au wirebond interface where corrosion primarily occurs. A deterministic empirical model describing wirebond degradation as a function of environmental conditions was generated. To demonstrate how this model can be used to determine corrosion effects on device reliability, a numerical simulation was performed on a three-lead voltage reference device. Surface reaction rate constants, environmental variables and the defect characteristics of the encapsulant were treated as distributed parameters. A Sandia-developed analytical framework (CRAX{trademark}) was used to include uncertainty in the analysis and directly calculate reliability.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 14091
- Report Number(s):
- SAND99-2621C; TRN: AH200136%%308
- Resource Relation:
- Conference: 196th Meeting of the Electrochemical Society, Honolulu, HI (US), 10/17/1999--10/22/1999; Other Information: PBD: 7 Oct 1999
- Country of Publication:
- United States
- Language:
- English
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