Method of accurate thickness measurement of boron carbide coating on copper foil
A method is disclosed of measuring the thickness of a thin coating on a substrate comprising dissolving the coating and substrate in a reagent and using the post-dissolution concentration of the coating in the reagent to calculate an effective thickness of the coating. The preferred method includes measuring non-conducting films on flexible and rough substrates, but other kinds of thin films can be measure by matching a reliable film-substrate dissolution technique. One preferred method includes determining the thickness of Boron Carbide films deposited on copper foil. The preferred method uses a standard technique known as inductively coupled plasma optical emission spectroscopy (ICPOES) to measure boron concentration in a liquid sample prepared by dissolving boron carbide films and the Copper substrates, preferably using a chemical etch known as ceric ammonium nitrate (CAN). Measured boron concentration values can then be calculated.
- Research Organization:
- Proportional Technologies, Inc., Houston, TX (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- SC0009615
- Assignee:
- Proportional Technologies, Inc. (Houston, TX)
- Patent Number(s):
- 9,810,635
- Application Number:
- 14/938,903
- OSTI ID:
- 1407708
- Resource Relation:
- Patent File Date: 2015 Nov 12
- Country of Publication:
- United States
- Language:
- English
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