Microchannel cooling of face down bounded chips
The present invention relates to cooling high power integrated circuits; and particularly to microchannel cooling of integrated circuits bonded face down on circuit boards, such as by flip-chip bonding. Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.
- Research Organization:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Dept. of Energy
- Patent Number(s):
- PATENTS-US-A7850634
- Application Number:
- ON: DE94007332; PAN: 7-850,634
- OSTI ID:
- 140523
- Resource Relation:
- Other Information: PBD: 1992
- Country of Publication:
- United States
- Language:
- English
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