Using atomic layer deposited tungsten to increase thermal conductivity of a packed bed

Van Norman, Staci A.; Tringe, Joseph W.; Sain, John D.; Yang, Ronggui; Falconer, John L.; Weimer, Alan W.

doi:10.1063/1.4917309

Title: Using atomic layer deposited tungsten to increase thermal conductivity of a packed bed

Journal Article · Mon Apr 13 00:00:00 EDT 2015 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.4917309· OSTI ID:1342071

Van Norman, Staci A. ^[1]; Tringe, Joseph W. ^[2]; Sain, John D. ^[2]; Yang, Ronggui ^[1]; Falconer, John L. ^[1];

^[1]

Univ. of Colorado, Boulder, CO (United States)
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

This paper investigated the effective thermal conductivity (k_eff) of packed-beds that contained porous particles with nanoscale tungsten (W) films of different thicknesses formed by atomic layer deposition (ALD). A continuous film on the particles is vital towards increasing k_eff of the packed beds. For example, the keff of an alumina packed bed was increased by three times after an ~8-nm continuous W film with 20 cycles of W ALD, whereas k_eff was decreased on a polymer packed bed with discontinuous, evenly dispersed W-islands due to nanoparticle scattering of phonons. For catalysts, understanding the thermal properties of these packed beds is essential for developing thermally conductive supports as alternatives to structured supports.

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Research Organization:: Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

Sponsoring Organization:: USDOE Advanced Research Projects Agency - Energy (ARPA-E)

Grant/Contract Number:: AC52-07NA27344; AR0000291

OSTI ID:: 1342071

Alternate ID(s):: OSTI ID: 1226735

Report Number(s):: LLNL-JRNL-665861

Journal Information:: Applied Physics Letters, Vol. 106, Issue 15; ISSN 0003-6951

Publisher:: American Institute of Physics (AIP)Copyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 5 works

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