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Title: Liquid cooled data center design selection

Patent ·
OSTI ID:1324400

Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center. The input data is evaluated to obtain performance of the data center thermal design. The performance includes cooling energy usage; and/or one pertinent temperature associated with the data center. The performance of the data center thermal design is output.

Research Organization:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0002894
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)
Patent Number(s):
9,445,529
Application Number:
13/479,265
OSTI ID:
1324400
Resource Relation:
Patent File Date: 2012 May 23
Country of Publication:
United States
Language:
English

References (8)

Energy efficient apparatus and method for cooling an electronics rack patent September 2010
Data center cooling patent February 2012
DATA CENTER CONTROL patent-application March 2011
Economizer Based Data Center Liquid Cooling with Advanced Metal Interfaces. Final Technical Report report November 2012
From chip to cooling tower data center modeling: Part I Influence of server inlet temperature and temperature rise across cabinet conference June 2010
Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems journal April 2009
Hybrid cooled data center using above ambient liquid cooling conference June 2010
Profiling Sustainability of Data Centers
  • Gmach, Daniel; Shah, Amip
  • 2010 IEEE International Symposium on Sustainable Systems and Technology (ISSST), Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology https://doi.org/10.1109/ISSST.2010.5507750
conference May 2010